Exposed-pipe technique: This technique applies to devices to be installed on one side. Copper pipes are pressed to deform into the grooves within an aluminum base plate and then a fly-cut is applied to the surface. This allows the quick removal of heat due to the high thermal conductivity of copper pipes. Meanwhile, the lightweight of aluminum can reduce the total weight and keep the cost to a reasonable extent.

Full-buriedpipe technique: The filler is a type of highly conductive epoxy resin which is imported from the US. When the temperature difference between two sides of a device is not critical, the liquid cold plate can be applied to either just one side or both sides of the device. Since the copper pipe thickness is not affected by any secondary machining and the application safety is ensured due to the protection of the filler, this technique is especially suitable for liquid cold plate applications which use refrigerant as the cooling medium.

Half-buried techniques: This technique is suitable for the combination of copper plate + copper tubes. It can reduce the plate thickness and generate the weight reduction effect.

Sandwiched-pipe technique: There are tubes between two plates and this technique is simple with lower cost. The combination could be aluminum plate + aluminum tubes/copper tubes/SUS tubes.