Semiconductor Cooling Modules and Semiconductor Water Cooling Plates are both advanced thermal management solutions used to regulate the temperature of semiconductor devices, but they function differently and serve different purposes.Semiconductor Cooling ModulesFunction: These modules generally use thermoelectric technology to create a temperature differential through the Peltier effect. They consist of thermoelectric elements that transfer heat from one side to the other when an electric current is applied.Components: A typical semiconductor cooling module includes thermoelectric elements, heat sinks, heat spreaders, insulation, and control circuitry.Applications: These modules are used in applications where precise temperature control is needed, such as in high-performance computing devices, medical equipment, and consumer electronics.Semiconductor Water Cooling PlatesFunction: These plates use liquid cooling technology to transfer heat away from semiconductor devices. Coolant flows through channels within the plate, absorbing heat from the semiconductor and then dissipating it to the environment via external heat sinks or radiators.Components: A water cooling plate includes coolant channels, heat spreaders, and external heat dissipation elements such as radiators or fans.Applications: These plates are used in high-performance computing systems, industrial applications, and other scenarios where effective heat dissipation is required.While semiconductor water cooling plates are not a part of semiconductor cooling modules, they can play a complementary role in a broader thermal management strategy.In Integrated Systems: In some advanced cooling setups, a semiconductor cooling module might be combined with a water cooling plate to enhance overall cooling performance. For example, the semiconductor cooling module might handle localized cooling, while the water cooling plate manages heat dissipation from the module to the environment.High-Performance Applications: For high-performance systems that require both precise temperature control and high heat dissipation capabilities, integrating both thermoelectric cooling modules and water cooling plates can optimize thermal management. The semiconductor cooling module could handle precise cooling of critical components, while the water cooling plate manages the overall heat load.SummarySemiconductor cooling modules and water cooling plates are distinct technologies used for different aspects of thermal management. Semiconductor cooling modules use thermoelectric effects for precise temperature control, whereas water cooling plates use liquid cooling for effective heat dissipation. They are not directly related as components but can be used together in advanced thermal management systems to achieve optimal cooling performance in high-demand applications.

I. Aspects to Consider in the Design of Liquid Cold Plate Heat Sink 1. Heat Dissipation: Heat dissipation is one of the most crucial factors in the design of a liquid cold plate heat sink. The greater the heat dissipation, the better the cooling effect. Therefore, when designing a liquid cooling plate, comprehensive consideration must be given to the materials used, manufacturing processes, the number, length, and diameter of the cooling channels, etc., to achieve optimal heat dissipation. 2. Flow Rate: Flow rate refers to the speed and volume of water flow within the liquid cold plate. Faster water flow generally improves the cooling effect. However, excessive flow speed can lead to increased water pressure and temperature. Thus, the design must balance the relationship between flow rate and pressure, considering factors such as volume, channel length, and wall materials to adjust to the optimal flow rate. 3. Material of Liquid Cooling Plates: The material of the liquid cooling plates should have high thermal conductivity, good mechanical strength, and compatibility with water. Common materials include copper, aluminum, and titanium alloys. When selecting materials, factors such as thermal conductivity, mechanical strength, corrosion resistance, and processing costs should be considered. 4. Strength Design: Strength is a critical aspect of designing a liquid cold plate heat sink to prevent leakage or seepage during actual use. The design should account for various load conditions based on the electronic equipment, controlling factors like material thickness, hole shapes, hole spacing, and support structure design to ensure the cold plate can withstand all operational loads. II. Standards for the Design of Liquid Cold Plate Heat Sink 1. Heat Dissipation Efficiency: The heat dissipation efficiency of the liquid cold plate heat sink should meet certain standards, generally above 80%. If the efficiency is below 80%, it indicates a design flaw that requires redesign. 2. Water Flow Speed: The water flow speed should be between 0.5 to 1 meter per second. Flow speeds that are too fast or too slow can adversely affect the cooling efficiency of the heat sink, so the flow rate needs to be adjusted to an optimal level. 3. Supply Water Temperature: The supply water temperature should typically be between 15 to 30 degrees Celsius. Deviations in water temperature can impact the heat dissipation effectiveness of the liquid cooling plate. 4. Leakage Rate: The design of the liquid cold plate heat sink should minimize the risk of leakage or seepage. Therefore, considerations such as metal expansion, rubber sealing, and structural tightness are critical to ensure the plate's sealing integrity. In summary, the design of custom liquid cold plate heat sinks must comprehensively consider heat dissipation, flow rate, material strength, and adhere strictly to standards to achieve the best cooling effect, ensuring stable performance and safe operation of electronic equipment.

There are various forming and processing techniques for aluminum alloy heat sinks, each with its unique characteristics and applicable scenarios. Integrated FormingAn integrated forming heat sink has its cooling fins and base plate as a single unit, eliminating thermal contact resistance. Die-Cast Aluminum Heat SinkThe advantages of die-cast aluminum heat sinks include low cost, high production efficiency, and the ability to create complex shapes. However, the material used is usually die-cast aluminum, which has a relatively low thermal conductivity, and there are limitations on the size of the fine cooling fins. Additionally, die-casting is suitable for high-volume production to spread out the cost of molds. Extruded Aluminum Heat SinkThe advantages of extruded aluminum heat sinks are low cost, short development cycle, and relatively high thermal conductivity of the material. Fine cooling fins can be made, but the ratio of fin height to thickness is limited (generally not exceeding 20), and complex shapes cannot be achieved. Cold forged Heat SinkThe advantages of cold-stamped heat sinks include the ability to create fine cooling fins and relatively high thermal conductivity of the material. However, the cost is relatively high, and the ability to handle irregular shapes is better than that of extruded aluminum. There is also a special type of integrated forming heat sink, as shown in the figure below: Skiving fin Heat SinkSkiving fin heat sinks can be made from copper, which has high thermal conductivity. The fins can be very fine, as they are directly chiseled from the base plate. However, when the fins are tall and long, they are susceptible to deformation due to stress. High-density fins can also be made inside water cooling heads using chiseling. We will discuss this in a separate topic later, so we won't elaborate here. It can be seen that the thickness, spacing, and height of the fins in integrated forming heat sinks are limited, which means that in some projects, they cannot meet the cooling requirements. This has led to the development of non-integrated forming heat sinks. Non-Integrated FormingNon-integrated forming heat sinks have the cooling fins and base plate processed separately and then assembled using welding, adhesive, or interference fitting techniques, resulting in thermal contact resistance. Folded Fin Heat SinkFolded fin heat sinks can be made from copper or aluminum, with high thermal conductivity. The fins can be very fine. Fins are first processed and then folded into the desired shape and welded to the base plate. This method is costly. Stamped Fin Heat SinkStamped fin heat sinks can be made from copper or aluminum with high thermal conductivity and can be very fine. The fins are first processed and then notched to fit and welded to the base plate. The process is complex and the cost is high. Inserted-Fin Heat SinkInserted-fin heat sinks have flexible thermal conductivity, fin thickness, and spacing compared to die-casting. The fins are inserted into the base plate, but the manufacturing difficulty is high, with a lower yield rate and relatively higher cost. Comparison of Heat Sink Processing TechniquesProcessAdvantagesDisadvantagesExtrudedBest cost-performance ratio, high thermal conductivityCannot achieve complex shapes, requires extensive machining Die-CastingVersatile shapes, attractive designs High mold costs, cost-effective only for large volumes, low thermal conductivity, limited effectiveness Skiving fin Can achieve the highest density and maximize fin area Cannot achieve complex shapes, height is limited Stamped Fin High fin density and height High cost, high mold costs, suitable for mass production, high requirements for the joining area Inserted-Fin High fin count ratio, large surface area Special process, generally used for specific products, relatively expensive 

As electronic products become more advanced, requiring more functions and higher reliability, excessive heat remains a major barrier to developing better-performing next-generation applications and breakthrough innovations. Every industry, especially mobile, medical, telecommunications, and the Internet of Things, is developing new products and systems that need to be lightweight, multifunctional, and capable of managing high thermal loads with high reliability. Engineers find it challenging to manage heat effectively as consumers demand smaller, thinner, more powerful devices with more options, functions, and capabilities. Phase-change cooling is rapidly evolving and becoming increasingly popular in addressing these issues. Heat pipes are particularly suited for heat dissipation, providing faster heat spreading, lightweight design, higher reliability, and longer lifespan. However, the most significant advantage of heat pipes is their design flexibility, allowing them to be easily integrated into thermal systems, thereby greatly improving cooling efficiency and capacity. Overview Heat pipe components combine the mature and reliable passive two-phase heat transfer with various other thermal management technologies to produce effective, durable cooling solutions. For over a decade, Lori has been innovating and manufacturing heat pipe solutions. Our experience enables us to design and manufacture effective and durable cooling solutions that can operate in the most demanding environmental conditions. Expandable copper walls and wicks can be bent or flattened to meet the thermal and geometric requirements of applications. This can be used to reduce overall size, increase surface contact, or arrange heat pipes around mounting hardware. Heat pipes can be embedded into other technologies to accelerate heat dispersion or use heat pipes within systems to transport heat from heat sources to locations where it can be safely dissipated. Misconception 1: If heat pipes fail, they will leak liquid onto my electronic device. Truth: Heat pipes rarely (if ever) rupture. In extremely unlikely cases, a very small amount of liquid inside the pipe will be completely saturated into the wick and cannot drip or leak onto your electronic device. Heat pipes are inherently robust, being purely passive systems with no moving parts that wear out over time. To “break” a well-manufactured heat pipe, you would need to cut the pipe or excessively bend or fold it. Heat pipes are filled with a vacuum during manufacturing, ensuring that the fluid inside always exists in vapor form and thus does not drip. Their durability, higher reliability, and leak-proof nature make heat pipes ideal for markets where traditional liquid solutions could cause catastrophic consequences, such as aerospace, medical, consumer electronics, and high-power applications requiring high reliability. Misconception 2: Heat pipes are heavy. Truth: Heat pipes can reduce the overall weight of the components more than they add. While they are often made of copper (a relatively heavy material), some believe that integrating heat pipes will add weight to their solutions. Although heat pipes are made of copper, they are hollow and can reduce the weight of the solution while improving thermal performance in multiple ways. Heat pipes are often used to transfer heat to cooler, more remote, and open areas within a device, where airflow and space are better, allowing for the addition of fans and lightweight fin structures to reduce the overall size and weight of the cooling solution. Another common example is replacing traditional copper heatsinks or larger heatsinks with aluminum-based heatsinks with embedded heat pipes. The high thermal efficiency of heat pipes can evenly and quickly distribute heat across the entire heatsink, improving heatsink efficiency and reducing the size and material required, thus lowering the overall weight and cost of the solution. Misconception 3: Heat pipes can only be used with evaporators and condensers at both ends. Truth: Heat pipes work along the entire length of the pipe, regardless of their position on the pipe, consistently transferring heat from the hotter to the cooler area. Heat pipes are typically designed as thermal management components to transfer heat from a heat source at one end to a safe and effective dissipation point at the other end. This is a common usage but not the only way to use heat pipes. The wick structure of heat pipes allows them to work in any orientation and typically spans the entire length of the pipe. Heat naturally moves from hot to cold, and heat pipes do the same. Regardless of where the heat is applied along the pipe, it always moves from the heat source to the condensation point and then returns through the wick. This increases design flexibility and heat pipe usage options, allowing for more innovative and cost-effective thermal management. One such use is embedding heat pipes to spread heat rather than transfer it. When heat pipes are embedded in the base of a heatsink, heat will condense along the entire length of the heat pipe rather than a fixed area. For example, integrating heat pipes into air-cooled heatsinks extends high-power performance, reducing the need for liquid systems when cooling high-power IGBTs. Misconception 4: Heat pipes can only spread heat in a straight line. If I want to spread heat across the entire base, I need a heat spreader. Truth: Heat pipes can be bent and used similarly to heat spreaders, but with a more integral structure. When heat pipes were initially introduced and began to be integrated with other technologies, they were embedded in straight lines. To achieve more even heat dissipation, engineers used heat spreaders. While heat spreaders effectively achieve uniform heat distribution, they come with their own set of design challenges that may not suit every application. Although heat pipes only move heat along their axis, this axis can be bent or used with multiple heat pipes to effectively serve as a plane spreading mechanism similar to a heat spreader. Heat pipes are cheaper, have greater structural integrity, and can be designed to mimic the function and performance of heat spreaders. When properly embedded, heat pipes can withstand considerable mounting forces in applications where vapor chambers may be too fragile. Misconception 5: Heat pipes need to be very hot to work. Truth: Manufacturing techniques allow heat pipes to operate even with very small temperature differences. Because heat pipes rely on evaporation and condensation to operate, there is a common misconception that a large temperature difference or high temperature is required to benefit from using heat pipes. However, since heat pipes are filled with a vacuum before sealing, the fluid inside exists in both liquid and vapor forms at its saturation point. This is similar to boiling a liquid at lower temperatures under reduced pressure at higher altitudes. Molecules require less heat to be excited to convert from liquid to vapor. Therefore, the temperature of the heat source does not need to reach the standard boiling point to induce the phase change from liquid to gas. In fact, only a few degrees of temperature difference between the "hot" and "cold" regions of a heat pipe are needed for it to function. This is one of the main benefits of using heat pipes as it minimizes the thermal resistance of the solution. Misconception 6: Heat pipes cannot be used in freezing conditions. Truth: Heat pipes can be designed to work under extremely harsh conditions, including freezing environments. The operational behavior of heat pipes under environmental conditions depends on the materials and design used. While copper/water is the most popular combination, other materials can be used based on specific requirements. Liquids like ammonia, methanol, and acetone can be combined with compatible metals to create heat pipes that operate at temperatures far below -60°C. Misconception 7: Heat pipes are expensive. Truth: Adding heat pipes can reduce the overall cost of the solution. The ductility of copper allows for economical manufacturing of heat pipes, reliable sealing, and easy bending and shaping into specific geometries. Lori has developed manufacturing processes and heat pipe technologies to produce cost-effective copper/water high-performance heat pipes. Heat pipes allow engineers to use aluminum-based and embedded heat pipes in applications that require copper fin bases, thus reducing costs. They can also eliminate the need for fans or other components, saving both money and weight.